 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Passiv gekuhlter SIRILAS(R) Diodenlaser 15 W cw bei 915nm Conductively cooled SIRILAS(R) Laser Diode Array 15 W cw at 915nm Lead (Pb) Free Product - RoHS Compliant SPL LG91-P Vorlaufiges Datenblatt / Preliminary data sheet Besondere Merkmale * Kostengunstige Strahlquelle fur Dauerstrichund Pulsbetrieb * Zuverlassiges InGaAs/GaAs kompressiv verspanntes Halbleiter-Material * Montage des Laserchips auf ausdehnungsangepasste Warmesenke * Kompaktes, den Laser schutzendes Gehause * Strahlabmessungen am optischen Austritt (Fenster) 7,0 mm x 0,3 mm * Verringerte vertikale Strahldivergenz durch Verwendung einer internen Linse Anwendungen * * * * * Pumpen von Festkorperlasern Direkte Materialbearbeitung Medizinische Anwendungen Erwarmen, Beleuchten Druckanwendungen Features * Efficient radiation source for cw and pulsed operation * Reliable InGa(Al)As strained quantum-well material * Mounting of laser bar on expansion matched submount * Compact package protecting the laser bar * Beam dimensions at optical port (window) 7,0 mm x 0,3 mm * Reduced fast axis divergence by use of internal lens Applications * Pumping solid state lasers (rod, fiber and disk lasers) * Direct material processing * Medical * Heating, Illumination * Printing Safety Advices Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 "Safety of laser products". Sicherheitshinweise Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Norm 60825-1 behandelt werden 2007-04-19 1 SPL LG91-P Typ Type SPL LG91-P 1) Wellenlange1) Wavelength1) 915 nm Bestellnummer Ordering Code tbd Andere Wellenlangen sind auf Anfrage erhaltlich. Other wavelengths are available on request. Grenzwerte (25 C heat sink temperature) Maximum Ratings Parameter Parameter Ausgangsleistung1) Output power1) Symbol Symbol min. Werte Values max. 20 50 W W - - Einheit Unit Popt Spitzen-Ausgangsleistung (quasi-continous Pqcw wave, tp 200 s, duty cycle 20%)1) Peak output power(quasi-continous wave, tp 200 s, duty cycle 20%)1) Betriebstemperatur2)1) Operating temperature2)1) Lagertemperatur2)1) Storage temperature2)1) Lottemperatur (tmax = 10 s) Soldering temperature (tmax = 10 s) 1) Top Tstg Ts + 10 - 40 - + 50 + 85 + 260 C C C Kurzzeitiger Betrieb. Der Betrieb bei den Grenzwerten beeinflut die Lebensdauer. Short time operation. The operation at the maximum ratings influences the lifetime. 2) Betauung des Moduls muss ausgeschlossen werden. Bedewing of the module has to be excluded. 2007-04-19 2 SPL LG91-P Dioden Kennwerte (25 C heat sink temperature) Diode Characteristics Parameter Parameter Zentrale Emissionswellenlange1) 2) Emission wavelength1) 2) Spektrale Breite (Halbwertsbreite)1) 2) Spectral width (FWHM)1) 2) Ausgangsleistung im Betriebspunkt1) Output power at operating point1) Differentielle Effizienz Differential efficiency Schwellstrom Threshold current Betriebsstrom1) Operating current1) Betriebsspannung1) 3) Operating voltage1) 3) Differentieller Serienwiderstand Differential series resistance Konversionseffizienz (elektrisch zu optisch)1) Conversion efficiency (electrical to optical)1) Charakteristische Temperatur (Schwelle)4) Characteristic temperature (threshold)4) Temperaturkoeffizient des Betriebsstroms Temperature coefficient of operating current Temperaturkoeffizient der Wellenlange Temperature coefficient of wavelength Thermischer Widerstand (pn-Ubergang Warmesenke) Thermal resistance (junction heat sink) Warmesenkentemperatur5) Heat sink temperature5) Strahldivergenz fast-axis (Vollwinkel 1/e2) Beam divergence fast axis (full angle, 1/e2) Strahldivergenz slow-axis (Vollwinkel 1/e2) Beam divergence slow axis (full angle, 1/e2) 2007-04-19 3 Symbol Symbol min. peak 910 - - - - - - - - Werte Values typ. 915 3.0 15 1.10 7 22 1.5 5 47 max. 920 - - - - - 1.7 - - Einheit Unit nm nm W W/A A A V m % Pop d Ith Iop Vop Rs con T0 - 150 0.5 0.3 1.3 - - - - K %/K nm/K K/W Iop / IopT - /T - - Rth JA Tfluid || + 10 - - + 20 1.4 9 + 30 - - C Grad deg. Grad deg. SPL LG91-P Dioden Kennwerte (25 C heat sink temperature) Diode Characteristics (cont'd) Parameter Parameter Strahlabmessungen am optischen Austritt Beam dimensions at optical output TE Polarisation TE Polarization 1) Symbol Symbol min. Werte Values typ. 7.0 x 0.3 90 max. - - - - Einheit Unit mm2 % wxh PTE Werte beziehen sich auf die Standardbetriebsbedingung 15W Ausgangsleistung, 25 C Warmesenkentemperatur. Values refer to standard operating conditions of 15W output power, 25 C heat sink temperature. Die zentrale Emissionswellenlange muss beim spezifizierten Strom kontrolliert werden. Liegt die Wellenlange hoher als im Testprotokoll spezifiziert, so weist dies auf einen schlechten thermischen Kontakt und eine thermische Uberbelastung der Laserdiode hin. Bevor der Laserbetrieb weitergefuhrt wird, muss der thermische Kontakt verbessert werden. Die zentrale Emissionswellenlange schiebt mit 0,3 nm/K. Check the emission wavelength at the specified current. A much longer wavelength than specified in the test protocol indicates bad thermal contact and thermal overload of the diode laser. Then the thermal contact has to be improved before continuing laser operation. The emission wavelength shifts with 0.3 nm/K. Das Anlegen einer Spannung in Sperrrichtung der Laserdiode muss ausgeschlossen werden. Reverse voltage applied to the laser diode has to be excluded. Modell zur Bestimmung des thermischen Verhaltens bzgl. des Schwellstroms: Model for the thermal behavior of threshold current: Ith(T2) = Ith(T1) x exp (T2 - T1)/T0 Warmesenkentemperatur beeinflusst die Ausgangsleistung, die zentrale Emissionswellenlange und die Lebensdauer. Betauung muss ausgeschlossen werden. Heat sink temperature influences output power, emission wavelength and lifetime. Condensation has to be excluded. 2) 3) 4) 5) 2007-04-19 4 SPL LG91-P Ligth-current and voltage-current curves (cw, 20 C) 2.0 V 1.6 OHW02730 Optical spectrum, relative intensity Irel vs. wavelength (15 W cw, 20 C) V 25 W 20 Pout 1.2 15 0.8 10 0.4 5 0 0 10 20 0 A 30 I 2007-04-19 5 SPL LG91-P Mazeichnung Package Outlines Mae in mm (inch) / Dimensions in mm (inch). Notes: Der optische Strahlaustritt liegt 1.5 mm uber der Unterseite der Gehausegrundplatte. Exit height of optical output beam is 1.5 mm referring to bottom side of package base plate. Gehausegrundplatte ist auf Anodenpotential. Package base plate is on anode potential. Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-04-19 6 |
Price & Availability of SPLLG91-P
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |